High Temperature Packaged Quartz Crystals
High Temperature Crystal Oscillator Products
High Temperature Electronic Module Products
Facilities
State-of-the-art, high volume ceramic package and hybrid facility.
Technical Capabilities
High Temperature Electronic Packaging (-55°C to 250°C).
Package Selection
Microelectronic circuits and components that are exposed to harsh environments require hermetic packaging.
Assembly Process
Using robust assembly techniques, Vectron offers the flexibility of applying a wide range of manufacturing processes to meet the customer’s unique application requirements and ensure the delivery of the highest quality product.
Environmental Screening
Complete MIL-STD and custom harsh environment screenings are available. Vectron will work closely with customers to define screening requirements.